How small can hybrid bonding connections get, according to Intel's Tyler Osborne?

Tyler Osborne, a director in Intel's advanced packaging group, says chip-to-chip connection pitch has fallen from 130 to 150 micrometres about 15 years ago to 25 micrometres in volume production today, with under 10 micrometres in Intel's lab. He cites a paper at this year's IEEE ECTC conference showing reliability data at 0.45 micrometres, and sees a long runway for further density.

• Osborne says chip-to-wafer bonding lets Intel bond only tested good dies, while wafer-to-wafer bonding loses yield when good and bad dies are paired.
• Finer connections also cut power per bit, which Osborne says helps non-AI devices such as laptops.

Source: our own transcription of the episode. The full conversation is on Dwarkesh Podcast (2026-10-22). Read the whole episode summary →

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